DIAMOND WAFERING BLADES

Brand：	USA/QMAXIS
Size：	3in, 4in, 5in, 6in, 7in, 8in, 10in
Concentration：	30HC, 20HC, 15HC, 20LC, 15LC, 10LC, 5LC
Description：	Precision Diamond Wafering Blades.

Information

DIAMOND WAFERING BLADES FOR PRECISION CUTTERS Arbor ½" [12.7mm], Thickness is listed under Part No. Qty 1/BOX
30HC continuous rim diamond wafering blades are recommended for soft gummy materials such as polymers, plastics, rubber.
Size	Thickness	Part No.
5in [127mm]	0.020in [0.5mm]	CD-5-30HC
7in [178mm]	0.025in [0.6mm]	CD-7-30HC

20HC continuous rim diamond wafering blades are recommended for ferrous and non-ferrous.
Size	Thickness	Part No.
5in [127mm]	0.020in [0.5mm]	CD-5-20HC
7in [178mm]	0.025in [0.6mm]	CD-7-20HC

15HC continuous rim diamond wafering blades are recommended for aggressive general laboratory sectioning of metal matrix composite, Cu, Al, Ti, PCBs, thermal spray coatings.
Size	Thickness	Part No.
3in [76mm]	0.006in [0.15mm]	CD-3-15HC
4in [102mm]	0.012in [0.3mm]	CD-4-15HC
5in [127mm]	0.015in [0.4mm]	CD-5-15HC
6in [152mm]	0.020in [0.5mm]	CD-6-15HC
7in [178mm]	0.025in [0.6mm]	CD-7-15HC
8in [203mm]	0.035in [0.9mm]	CD-8-15HC

20LC continuous rim diamond wafering blades are recommended for hard tough materials such as structural ceramics, silicon carbide, boron carbide, silicon nitride, boron nitride.
Size	Thickness	Part No.
5in [127mm]	0.015in [0.4mm]	CD-5-20LC
7in [178mm]	0.025in [0.6mm]	CD-7-20LC
8in [203mm]	0.035in [0.9mm]	CD-8-20LC

15LC continuous rim diamond wafering blades are recommended for sectioning very hard or brittle materials including ceramics, sintered carbides, silicon and boron composites, glass, rock, Al₂O₃ , ZrO₂ and concrete.
Size	Thickness	Part No.
3in [76mm]	0.006in [0.15mm]	CD-3-15LC
4in [102mm]	0.012in [0.3mm]	CD-4-15LC
5in [127mm]	0.015in [0.4mm]	CD-5-15LC
6in [152mm]	0.020in [0.5mm]	CD-6-15LC
7in [178mm]	0.025in [0.6mm]	CD-7-15LC

10LC continuous rim diamond wafering blades are recommended for medium to soft ceramics and glass fiber reinforced composites.
Size	Thickness	Part No.
3in [76mm]	0.006in [0.15mm]	CD-3-10LC
5in [127mm]	0.015in [0.4mm]	CD-5-10LC
7in [178mm]	0.025in [0.6mm]	CD-7-10LC

5LC continuous rim diamond wafering blades are recommended for soft and friable ceramics, CaF₂, MgF₂ and composites with fine reinforcing media.
Size	Thickness	Part No.
3in [76mm]	0.006in [0.15mm]	CD-3-5LC
5in [127mm]	0.015in [0.4mm]	CD-5-5LC

DIAMOND WAFERING BLADES FOR ABRASIVE CUTTERS Arbor 1¼" [32mm], Thickness is listed under Part No. Qty 1/BOX
Application	Bonded	Thickness	Part No.
General purpose	Resin	0.060in [1.5mm]	CD-10-01
Hard materials	Resin	0.060in [1.5mm]	CD-10-02
Ceramics and petrographic samples	Metal	0.044in [1.1mm]	CD-10-03

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