QMAXIS cold mounting systems, including epoxy mounting systems and acrylic mounting systems, have low viscosity, low shrinkage, low peak exotherm, and good pore penetration.
Information
EpoQuick
Using: Quick mounting
Cure time: 2 h
Clarity: Clear
Viscosity: Very low
Shore D: 80
Peak Temp: 230ºF/110ºC
Mixing resin to hardener: 5:1
Resin
Hardener
Qty
Part No.
Qty
Part No.
32oz [950ml]
ME-01-032
8oz [240ml]
MH-01-008
1gal [3.8L]
ME-01-128
32oz [950ml]
MH-01-032
EpoCure
Using: General mounting
Cure time: 6 h
Clarity: Clear
Viscosity: Low
Shore D: 80
Peak Temp: 104ºF/40ºC
Mixing resin to hardener: 4:1
Resin
Hardener
Qty
Part No.
Qty
Part No.
32oz [950ml]
ME-02-032
8oz [240ml]
MH-02-008
1gal [3.8L]
ME-02-128
32oz [950ml]
MH-02-032
EpoFlow
Using: Pore penetration and heat sensitive materials (as PCBs)
Cure time: 9 h
Clarity: Clear
Viscosity: Low
Shore D: 78
Peak Temp: 104ºF/40ºC
Mixing resin to hardener: 2:1
Resin
Hardener
Qty
Part No.
Qty
Part No.
32oz [950ml]
ME-03-032
16oz [470ml]
MH-03-016
1gal [3.8L]
ME-03-128
64oz [1.9L]
MH-03-064
EpoLi-ion
Using: Lithium batteries
Cure time: 24h/25℃ or 2h/60℃
Clarity: Wheat/Khaki
Viscosity: 7000-9000/100-300
Shore D: 85
Component: Q1707-1RA/Q5230B
Mixing resin to hardener: 100:30
Feature: Resistance to electrolyte corrosion
Resin
Hardener
Qty
Part No.
Qty
Part No.
5kg
ME-04-5
5kg
MH-04-5
10kg
ME-04-10
10kg
MH-04-10
AcryQuick
Using: Fast cure, especially for electronics and PCBs